Singapore-headquartered data center platform DayOne Data Centers is seeking a HKD1.86 billion (US$240 million) loan to support its Hong Kong data center, according to Bloomberg citing people familiar with the matter. The DC operator is in talks with a consortium of Asian banks including Singapore’s top banks, DBS Group Holdings Ltd, Oversea-Chinese Banking Corp (OCBC) and United Overseas Bank Ltd (UOB), for the five-year facility.
The Hong Kong data center is a purpose-built data center cluster in Kwai Chung, delivering 66MW of capacity.
DayOne is actively expanding its footprint across the region and beyond in the past few months. Just recently, it filed confidentially for an IPO in the US for a potential US$ 5 billion raise. The IPO could be as early as next quarter.
DayOne, UOB, OCBC and DBS declined to comment.
Last week, it announced a US$ 415 million green loan from DBS, OCBC and UOB. The sustainability-linked loan will support DayOne’s proof of concept in hydrogen-powered data center at its Singapore facility. It is also seeking to double the size of an existing loan to about US$ 7 billion, which would be the largest loan in the data center industry in Asia if successful.