Viettel Group has officially broken ground on the construction of Vietnam’s first semiconductor chip fabrication plant, laying the foundation for a domestic semiconductor ecosystem. The national project, assigned by the Ministry of National Defence, in accordance with a Government Resolution, is expected to be completed by the end of 2027, said Lieutenant General Tao Duc Thang, Chairman and CEO of Viettel Group.
“Immediately after today’s groundbreaking ceremony, the Group will begin implementing the project, with the set objective that by the end of 2027, we will complete the construction, receive technology transfer, and begin pilot production. From 2028 to 2030, we will focus on finalizing and optimizing processes and improving line efficiency in accordance with industry standards, thereby serving as a basis for researching chip fabrication technology at more advanced process nodes.”
The company’s press release noted that the project will be implemented during 2026–2030, with a roadmap from plant construction and technology transfer to process completion and improved operational efficiency.
Located on Hoa Lac Hi-Tech Park (Hanoi) spread across an area of 27 hectares, the plant is scalable, and is planned to serve research, design, testing, and semiconductor chip production activities. Industries requiring semiconductor chips include data centers, aerospace, telecommunications, IoT, automotive manufacturing, medical devices, and automation.
A complete semiconductor chip product typically goes through six main stages: product definition, system design, detailed design, chip fabrication, packaging and testing, and integration and testing. In recent years, Vietnam has gradually participated in five of these stages; however, chip fabrication—the most complex and critical stage—has not yet been possible domestically. Building a semiconductor chip fabrication plant will help complete the entire semiconductor chip production process in Vietnam.
Speaking at the groundbreaking ceremony, Prime Minister of Vietnam Pham Minh Chinh said: “The groundbreaking of Vietnam’s first high-tech semiconductor chip fabrication plant is a step toward realizing the national semiconductor industry development strategy, creating a foundation for Vietnam to gradually participate more deeply in the global value chain, based on science, technology, and innovation.”
According to the Prime Minister, the plant’s presence will contribute to completing the domestic semiconductor ecosystem, enabling chip design companies, technology start-ups, and research institutions to shorten testing cycles, quickly finalize products, and bring technology into practical applications.
The plant is also expected to become a hands-on training center for the semiconductor workforce, linking training with a real production environment. Through this, Vietnam aims to train 50,000 chip design engineers under the Semiconductor Industry Human Resources Development Program through 2030, and doubling to 100,000 people under the National Semiconductor Strategy through 2040.
The groundbreaking of the plant marks an important milestone in Vietnam’s journey to build technological capability, contributing to realizing its national goal of “Technological self-reliance, Sustainable Future.”
Launched in Hanoi on 16 January, the ceremony was attended by Party General Secretary Tô Lâm and Prime Minister Phạm Minh Chính, among others.